PRO 1600 is a full forced air / nitrogen convection reflow oven with only a 31" x 31" footprint of floor space.

PRO 1600-RS is specifically configured for reflow simulation, package qualification, solderability and thermal stress testing applications.

The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes.

The AT-GDP Series SMD / BGA Rework Stations feature the latest vision and thermal process control technologies.