Options / Accessories

Stencils - allow for repeatable and efficient transfer of solder paste to the spheres of a component. Every stencil supplied comes mounted on a universal fixture.

Flux Transfer Plates - placed on the Positioning Nest System, they are used for applying uniform level of flux to the solder spheres of a component.

0201 Rework Package - allows rework of components as tiny as 0201. Precise optics and nozzle technology provides accurate placement and uniform reflow.

Solder Removal System (SRS) - provides accurate and effective removal of excess solder from the "reworked" area on the PCB. The non-contact design ensures safe and damage-free operation.

FCB Package (Flip Chip Bonding) - converts the base system to a flip chip bonder within minutes. Placement force control, tray pick-up, and FP positioning system, are pre-installed features. Flux plates are used for even application. Heavy-Duty design prevents component shifts during alignment and heating. Perfect for prototype to low-volume development. FCB may be customized to various application requirements.

Nozzle Kit - (includes the following nozzles: 40mm x 40mm, 36mm x 36mm, 30mm x 30mm, 25mm x 25mm, 21mm x 21mm, 17mm x 17mm, 14mm x 14mm, 10mm x 10mm, 8mm x 8mm, 6mm x 6mm).