AT-707 BGA/CSP Placement & Rework Station Overview and Features

The AT-707 is a semiautomatic placement & rework station featuring the latest vision and process control technologies. Complex components such as BGA’s, CSP’s, ultra fine pitch QFP’s, Micro SMD’s, and Flip Chips are reworked with ease and precision. Computer control coupled with a comprehensive software package automates the chip removal / installation processes. High level of automation limits intervention by the operator which in turn translates into high yields and consistently repeatable results. Split Vision allows simultaneous top of the PCB / bottom of the component viewing to superimpose and align (using the X, Y and Theta micrometer adjustments) the images. A Split Imaging Device creates diagonal corner viewing for alignment of larger packages at high magnification. It is also critical in viewing the walls of the nozzle in relation to the PCB to ensure that adjacent components will not be interrupted during reflow. Adjustable placement pressure ensures complete control in rework of various package types.

At the click of an icon, the system automatically places the component onto the PCB, shuts off the vacuum to the pick up tube, lifts the pick up nozzle away from the package body, executes a reflow profile, and raises the reflow head at the completion of a cycle. Removal features the same automation only now, the vacuum stays on throughout the process as the component is pulled off the board at the completion of the cycle. Forced convection heating from both the top and bottom of the PCB ensures unsurpassed temperature uniformity. The system is Lead-Free compatible and features a unique software controlled two-stage soak phase for large, high thermal mass assemblies. The AT-707 offers unparalleled performance, ease of use, and an exceptional value making it a superior system heads above the competition.