AT-DB Flip Chip Die Bonder For Engineering & Assembly

Advanced Technologies US Inc. (ATCO) offers the latest AT-DB Flip Chip & Die Bonder for precision based assembly utilizing advanced software for seamless thermal compression and solder attachment.

Dedicated to providing the best die bonders for engineering applications in the industry, all of our products undergo rigorous research and development, including a 5-year warranty on parts and labor, and come complete with the best installation, repair, and calibration services in the industry.

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4.

 

AT-DB Flip Chip & Die Bonder Equipment

What Can Our Flip Chip Die Bonder Be Used For?

When precision circuit assembly and repair are necessary, it’s important to find a manufacturing partner that understands the detailed intricacies of the industry.

With over 35 years of experience in the PCB industry, ATCO products provide unmatched production capabilities for superior results translating into improvements across the spectrum of your business model.

Our advanced Flip Chip and Die Bonders are ideal for:

  • Engineering & Assembly
  • Research & Development
  • Low Volume Production

Implementation of a die bonder/flip chip bonder into your production or research processes greatly improves your businesses’ capabilities.

First of all, a flip chip bonder assembly is much smaller than traditional circuit board carriers, allowing for diverse research applications and ease of assembly. Flip chips resting directly upon the circuit medium greatly reduce inductance over traditional circuit assembly, improving signal transmission while simultaneously improving heat conductance.

These advantages enable production capabilities that are otherwise out of reach for companies in need of revolutionary assembly solutions.

Our die bonder is manufactured with the end user in mind. We provide complete installation and training and walk you through the entire operational parameters.

Our user-friendly software guides you through a simple setup and provides detailed descriptions throughout every step of the process. With our extensive training and simple interface, you can expect precise AT-DB Flip Chip and Die Bonder results every time.

The Best Maintenance Free Die Bonder

Our flip chip bonder is built by the leading experts in the die bonder industry. We stand behind our extensively researched products and offer quality that is built to last. All of our die bonders come with our all-inclusive support features, allowing your business to focus on production and research, rather than troubleshooting and repairs.

All of our flip chip and soldering stations are manufactured in the United States. We take pride in providing soldering equipment developed with the finest materials available. When you partner with ATCO for all of your flip chip soldering and thermo compression circuitry needs, you can expect collaboration and expertise guiding your team every step of the way.

Learn More About Our Die Bonder and SMD Machines

When you partner with ATCO for your SMD applications, you can expect a team dedicated to your success. With unparalleled guidance from installation to calibration, we are your comprehensive solution from research to product development.

Get in touch with our friendly customer service team today. We offer complimentary product brochures and will gladly discuss all of our products with you in detail. Our experienced technicians will help you select the ideal products for effective integration with your business so you can get started developing precision circuits and quality research today!