The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes. Precise mechanics and advanced software simplifies the optical alignment, placement, and bonding stages of the process. Operator involvement is limited making these systems easy to setup and use. Available in benchtop and standalone configurations, these machines are ideal for prototype R&D, NPI, Engineering, Failure Analysis labs as well as OEM / CEM production environments. Automation, machines' capability, and ease of use are critical for both prototype and production volume applications requiring consistency and quality.
Solid design enables ultra precise placement of flip chips and dies to within 0.0002" or 5 microns. A newly implemented software driven Force Measurement System makes it possible to handle fragile dies down to 0.2mm x 0.2mm. Alignment is performed using split vision optics allowing simultaneous view of the substrate and flip chip / die. The two images are superimposed using micrometers on a precision vacuum locking stage. Software contains a database of predefined profiles which the user selects based on the die and substare. Profiles may be easily modified, optimized, and stored for future use. Settings can be adjusted on-the-fly while the profile is running. Software controlled heating at the die is performed via a convection Air / Nitrogen heater. Substrate can be heated via a conductive as well as a convective stage heaters. Critical process parameters like bonding force, heating ramp up rates, temperatures, dwell times, gas flow, and cooling rates are monitored by the software to deliver consistent quality.
Like other machines that our company has been producing for past 30 years, AT-DB was designed to be very easy to use and capable of handling both today’s and tomorrow’s requirements. AT-DB series offers unparalleled performance aimed at applications where precision and consistently high quality results matter. Ranging from R & D, NPI, Engineering, and batch production environments.
Profiles are developed, stored, and recalled in the AT-DB’s software package. It controls the heating cycle, bonding force, automation of process sequences, and automatic execution of safety checks before every profile run.
|Substrate Handling||Up to 12" x 14" (305mm x 355mm)||Up to 16" x 20" (406mm x 508mm)||Up to 16" x 20" (406mm x 508mm)|
|Maximum||0.98” x 0.98” (25mmSQ)||0.98” x 0.98” (25mmSQ) Optional 1.58” x 1.58” (40mmSQ)||0.98” x 0.98” (25mmSQ) Optional 1.58” x 1.58” (40mmSQ)|
|Minimum||0.008” x 0.008” (0.2mm x 0.2mm)||0.008” x 0.008” (0.2mm x 0.2mm)||0.008” x 0.008” (0.2mm x 0.2mm)|
|Substrate Thickness||Up to 0.32” (8mm)||Up to 0.32” (8mm)||Up to 0.32” (8mm)|
|Placement Accuracy||+/- 0.0002" (+/- 5 microns)||+/- 0.0002" (+/- 5 microns)||+/- 0.00004" (+/- 1 microns)|
|Top Heater (Air/N2 Conv.)||1000 Watts||1000 Watts||1000 Watts|
|Conductive Stage Heater||2500 Watts||3500 Watts||3500 Watts|
|Convection Heater||2000 Watts||2000 Watts||2000 Watts|
|Magnification||Up to 420X||Up to 420X||Up to 420X|
|Bonding Force||up to 300 N||up to 300 N||up to 300 N|
|Power||208-240 VAC 25A,1 Phase, 50/60 Hz||208-240 VAC 30A,1 Phase, 50/60 Hz||208-240 VAC 30A,1 Phase, 50/60 Hz|
|Air / Gas||95-120 PSI @ 4 CFM||95-120 PSI @ 4 CFM||95-120 PSI @ 4 CFM|
|Facility Placement||Heavy Duty Bench (500lbs. minimum weight capacity)||Heavy Duty Bench (500lbs. minimum weight capacity)||Stand Alone Floor Unit|
|Weight||224 lbs / 101 Kg||240 lbs / 110 Kg||280 lbs / 127 Kg|
|Dimensions||36"L x 18"W x 44"H (915mm x 457mm x 1118mm)||48"L x 18"W x 44"H (1220mm x 457mm x 1118mm)||48"L x 28"W x 78"H (1220mm x 711mm x 1981mm)|
|Warranty||Five (5) years parts and labor||Five (5) years parts and labor||Five (5) years parts and labor|