Reflow Oven for PCB Soldering

PRO 1600 is a full forced air / nitrogen convection reflow oven with only a 31" x 31" footprint of floor space. It has been designed for reflow soldering of even the most challenging applications including metal core, high thermal mass, and ceramic assemblies. PRO 1600 is very flexible in terms of profile development and optimization. Sealed heating chamber enables air ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. It offers a unique On-The-Fly settings adjustment capability that allows creating and optimizing profiles all in a single pass. Where other batch and conveyor ovens fail to meet the desired profile curve, PRO 1600 excels.

Precise software control delivers unsurpassed temperature uniformity. Maintaining a low delta T across all of the components on the assembly ensures that they are not overheated or thermally stressed. Even for prototypes, this often means avoiding to spend hours of testing and debugging failed boards. With the optional External Thermocouple Control (ETC), profiles may be processed based on temperature readings of the assembly, not the air temperature around it. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle. Increased productivity, superior performance and ease of operation make the PRO 1600 a versatile system ideal for small to medium run production, prototyping, NPI, testing or curing.

Customer List         Financing Available

• Full Convection Air / Nitrogen Reflow
• Up to 10 individually programmable zones
• Small Footprint of 31" x 31"
• Computer control with unlimited profile storage capacity
• Comprehensive software package with monitoring and profiling capability
• No Warm-Up time required before operating
• Integrated Exhaust / Fume Cleaning Unit
• Nitrogen ready with low rates of consumption
• External Thermocouple Control
• Automatic Profile Repeat function (up to 10 times)
• Library of predefined profiles
• Password protected login for engineers and operators
• Plug and Operate Configuration
• Minimal maintenance
• Designed and Manufactured in USA

• Printed Circuit Board (PCB) assemblies requiring high quality and repeatable results in prototype - medium volumes (depending on PCB size).
• Single or Double Sided PCB’s with standard or Pb-Free solders.
• Densely populated, metal core, and high thermal mass assemblies.
• Surface Mount Devices per IPC / JEDEC J-STD-020 and JESD22-A113F standards for Leaded and Pb-Free profiles
• Reflow of solder preforms in an inert atmosphere.
• IPC-TM-650 Test Method 2.6.27 - Thermal Stress, Convection Reflow Assembly Simulation / IPC-9631. 
• Bare PCB’s to simulate profiles developed for volume production environments.
• Delamination and other quality issues testing on multilayer PCB’s.
• Various composite materials for analysis / testing.
• Ceramic substrates to Gold Plated Nickel / Copper housings using preforms in an atmosphere with <50 PPM of Oxygen.
• Copper heatsinks to PCB’s using preforms.
• Gold / Tin reflow.
• Wafer Bumping with Oxygen levels below 25 PPM
• Preconditioning reflows of IC’s while in extruded aluminum tubes.
• Aluminum pins to a metal housing.
• Flex connector to ceramic substrate.
• Surface Mount Devices / Passive Components to ceramic substrate.
• Connector filters with fluxed preforms.
• LED’s in production quantities.
• Various solder pastes for analysis in an R&D environment.

Once the Power-Key switch is turned to the On position, top cover automatically opens while the loading tray slides out. Parts are loaded onto a mesh tray and the profile is selected with a few mouse clicks.

After the Start icon is activated, the tray automatically slides into the heating chamber at an adjustable and controlled speed. A profile is then executed as per the pre-programmed parameters. Software constantly monitors actual ramp up rates and temperature inside an oven to the programmed values for accuracy. At the completion of a reflow cycle, the tray automatically exits from a heating chamber. PRO 1600 is now in a standby mode, ready for a new cycle run.

The following parameters may be programmed for each profile:

• Up to 5 Ramp Up stages ( ° Celsius / second)
• Up to 5 Temperature stages
• Up to 5 Time at Temperature stages
• Up to 4 In-Process Cooling stages
• Final Cooling stage
• Cooling Modes - 4 types
• Initial Lag time to reach low Oxygen level
• Nitrogen purge time
• Automatic Profile Repeat (up to 10 times)

Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.

• Real-Time process graphing
• Profile processing based on part / PCB temperature control*  
• Profile development with up to 7 thermocouples*
• Library with predefined profiles
• On-The-Fly settings adjustment
• Real- time data recording for documentation and analysis
• Password Protected Access
• User friendly environment
• Designed for Windows® 7 / 10 Pro OS

*Optional

There are two standard configurations of the PRO 1600 series. They both share the same design and principle of operation. Below is a comparison matrix outlining features of each model. Additionally, various modifications may be made to satisfy specific application requirements. They include higher temperature rating, process video recording, and fixture customization.

• External Thermocouple Control (Part: ETC-PRO)
  • profile is executed based on temperature reading from the application
  • allows for both fixed and external thermocouple control
• Multiple Thermocouple Data Acquisition System (Part: MTDA-PRO)
  • built-in 7 thermocouple interface controller for profile development
  • 7 K-type thermocouples
• Double Sided PCB Fixture (Part: DSBF-PRO)
• External Cooling Fans Module (Part: ECF-PRO)
• Laptop Computer Stand (Part: LCS-PRO)
• Custom Fixtures / Tooling
• Video Recording and Observation Module (Part: VRM-PRO)