The AT-GDP Series SMD / BGA Rework Stations
feature the latest vision and thermal process
control technologies. Printed circuit boards and
substrates consisting of components such as BGA’s,
CSP’s, QFN’s, Flip Chips, PoP, Wafer Level Dies,
and many other SMD’s are processed with consistently
high quality results. Wafer Level Dies, and many other
SMD’s are processed with consistently
high quality results.

The AT-DB Flip Chip Die Bonders enable
bonding via solder attach, thermal compression,
and epoxy die attach processes. Precise mechanics
and advanced software simplifies the optical
alignment, placement, and bonding stages of
the process. Operator involvement is limited
making these systems easy to setup and use.
Available in benchtop and standalone
configurations,

PRO 1600 is a full forced air / nitrogen convection
reflow oven with only a 31" x 31" footprint of
floor space. It has been designed for reflow
soldering of even the most challenging applications
including metal core, high thermal mass, and ceramic
assemblies. PRO 1600 is very flexible in terms of
profile development and optimization. Sealed
heating chamber enables air ramp up rates of
up to 4° Celsius/second from ambient and programming
of up to 10 profile zones.

PRO 1600-RS is specifically configured for reflow simulation, package
qualification, and thermal stress testing applications. This
includes Preconditioning of Nonhermetic Surface Mount Devices (SMD)
per JESD22-A113G standard, Moisture Sensitivity Level (MSL) testing
of packages per IPC / JEDEC J-STD-020E, and thermal stress testings
as performed by PCB fabricators to IPC-TM-650 Test Method 2.6.27 /
IPC-9631 standards. Instead of performing reflows in an inline tunnel
oven which typically range 12 ft. - 20 ft. in length, the batch design
of this reflow simulator enables processing is a compact footprint of
only 31" x 31".