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New Special Offer - Complete Nozzle Kit Included with AT-GDP machines

Written by Super User On Thursday, 10 November 2016 00:06

For a limited time, orders for AT-GDP series BGA / SMT Placement & Rework Stations will include the optional Nozzle Kit at no additional charge, valued at $2,250. The Nozzle Kit (Part: NZK-ATGDP) contains various sized nozzles covering most components available on the market. Along with the 2 standard nozzles included with a machine, for most customers this will represent a "complete set" without having the need to purchase additional nozzles later on.

Reflow Oven Video Recording Module

Written by Super User On Thursday, 10 November 2016 00:06

Upgraded video observation module for Pro 1600 Reflow Oven now allows taking still images and recording video during a reflow cycle. The module includes a dual panel 16” X 16” high temperature rated glass cover, high resolution camera with optical and digital zoom, lighting system, multi-angle adjustable camera mounting, and an advanced Imaging Capture software.

New Force Measurement System for AT-GDP SMT / BGA Rework Station

Written by Super User On Thursday, 10 November 2016 00:06

A newly implemented Force Measurement System for the AT-GDP series machines allows for a more controlled process. It is especially critical to have a precise force measurement when picking up and placing delicate and very small packages. Additionally, newer package technologies like stacked dies or PoP require placement force control to prevent damaging the component. Force Measurement is software controlled and is available on all configurations of the AT-GDP machines.

0201 Passives Module for AT-GDP Rework Stations

Written by Super User On Thursday, 10 November 2016 00:06

Micro passive components as small as 0201 (0.6mm x 0.3mm) may now be reworked with the optional 0201 Handling module. This option includes tooling for pick up from cut tape. The Process Monitoring Camera option is required to be used in conjunction with 0201 handling module.

4-Ball WLCSP / BGA measuring 0.8mm x 0.8mm - Placement and Soldering

Written by Super User On Thursday, 10 November 2016 00:06

New application video: Rework of a 4 - ball Wafer Level Chip Scale Package (WLCSP) measuring 0.8mm x 0.8mm from a 7mm x 6mm PCB. The 4 solder balls that are 0.26mm in diameter with 0.4mm pitch. The removal / installation process was performed using the AT-GDP Placement & Rework Station.

New Website Launched

Written by Super User On Thursday, 10 November 2016 00:06

ATCO’s website has been redesigned and now contains more in depth product related information. Visitors may read application notes and view videos detailing rework, assembly, and soldering processes.

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