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Visit us at IPC High Reliability Forum on May 15-17, 2018 in Linthicum (Baltimore), MD.

Written by Admin On Monday, 23 April 2018 20:40
We will be presenting PRO 1600 Reflow Oven and PRO 1600-RS Reflow Simulator configured for the recently updated IPC-TM-650 Test Method 2.6.27 Rev.A (Thermal Stress, Convection Reflow Assembly Simulation).

IPC APEX EXPO 2018 in San Diego, CA from 02/27/18 - 03/01/18 - Booth 2847

Written by Admin On Friday, 15 December 2017 21:58
ATCO will be exhibiting at the upcoming IPC APEX EXPO 2018 in San Diego, CA from February 27th - March 1st. Booth 2847. Stop by to discuss your application requirements for SMD / BGA rework and reflow soldering. On display we will have the AT-GDP BGA Rework Station and PRO 1600 Reflow Oven. Details will be available for all models of BGA Rework Stations, Reflow Ovens, Reflow Simulator, and Flip Chip Die Bonder.

SMTA Capital Expo & Tech Forum - August 24, 2017 Johns Hopkins University – Applied Physics Lab (Laurel, MD)

Written by Admin On Thursday, 24 August 2017 21:27
See us at the SMTA Capital Expo where we will present details and answer questions on the following systems: BGA Rework Station, Reflow Oven, Flip Chip Die Bonder.

SMTA Ohio Expo & Tech Forum July 13, 2017 Independence (Cleveland), OH

Written by Admin On Thursday, 13 July 2017 16:50
Join us at the upcoming SMTA Ohio Expo & Tech Forum held at Embassy Suites (Independence, OH). We will be on site to discuss equipment and process related questions. Presentations will be available for the following products: AT-GDP BGA Rework Station, PRO 1600 Reflow Oven, PRO 1600-RS Reflow Soldering Simulator.

New Machining Center Installed

Written by Admin On Thursday, 13 April 2017 03:11
ATCO has recently installed a new HAAS machining center adding capacity to our metalworking capabilities. The center will aid in quick turn machining of custom tooling for our customer base.

New Special Offer - Complete Nozzle Kit Included with AT-GDP machines

Written by Admin On Thursday, 10 November 2016 00:06

For a limited time, orders for AT-GDP series BGA / SMT Placement & Rework Stations will include the optional Nozzle Kit at no additional charge, valued at $2,250. The Nozzle Kit (Part: NZK-ATGDP) contains various sized nozzles covering most components available on the market. Along with the 2 standard nozzles included with a machine, for most customers this will represent a "complete set" without having the need to purchase additional nozzles later on.

Reflow Oven Video Recording Module

Written by Admin On Thursday, 10 November 2016 00:06

Upgraded video observation module for Pro 1600 Reflow Oven now allows taking still images and recording video during a reflow cycle. The module includes a dual panel 16” X 16” high temperature rated glass cover, high resolution camera with optical and digital zoom, lighting system, multi-angle adjustable camera mounting, and an advanced Imaging Capture software.

New Force Measurement System for AT-GDP SMT / BGA Rework Station

Written by Admin On Thursday, 10 November 2016 00:06

A newly implemented Force Measurement System for the AT-GDP series machines allows for a more controlled process. It is especially critical to have a precise force measurement when picking up and placing delicate and very small packages. Additionally, newer package technologies like stacked dies or PoP require placement force control to prevent damaging the component. Force Measurement is software controlled and is available on all configurations of the AT-GDP machines.

0201 Passives Module for AT-GDP Rework Stations

Written by Admin On Thursday, 10 November 2016 00:06

Micro passive components as small as 0201 (0.6mm x 0.3mm) may now be reworked with the optional 0201 Handling module. This option includes tooling for pick up from cut tape. The Process Monitoring Camera option is required to be used in conjunction with 0201 handling module.

4-Ball WLCSP / BGA measuring 0.8mm x 0.8mm - Placement and Soldering

Written by Admin On Thursday, 10 November 2016 00:06

New application video: Rework of a 4 - ball Wafer Level Chip Scale Package (WLCSP) measuring 0.8mm x 0.8mm from a 7mm x 6mm PCB. The 4 solder balls that are 0.26mm in diameter with 0.4mm pitch. The removal / installation process was performed using the AT-GDP Placement & Rework Station.

New Website Launched

Written by Admin On Thursday, 10 November 2016 00:06

ATCO’s website has been redesigned and now contains more in depth product related information. Visitors may read application notes and view videos detailing rework, assembly, and soldering processes.

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