Introduction

An increase in implementation of Flip Chips, Dies, and other micro SMD devices with hidden joints within PCB and IC assembly sectors requires capability to precisely install and rework such devices. This article details the installation process of a Flip Chip onto a BGA IC substrate using an AT-GDP Rework Station. A Eutectic Soldering process is being applied.

Components

The Flip Chip measures 8.25mm x 6mm while the BGA substrate is 35mm x 35mm (Figure 1). Flip Chip contains 560 solder bumps with each bump measuring 65μm in diameter and the pitch is as fine as 180 μm. Figure 2 shows an actual image of a Flip Chip captured on the AT-GDP Rework Station’s camera view screen. Figure 3 displays the corresponding pads on a BGA substrate.