Advanced Techniques US

March 2008 - Website Under Development
This website is currently being redesigned. Check back soon for the latest updates and product information.

August 2007 - Applications Support
Potential customers considering acquiring equipment are encouraged to send sample assemblies / parts for profile development. A line graph will be generated from reflow simulation to match that of a desired profile curve.

May 2007 - Reflow and Rework Equipment are Lead Free Ready
The following models are declared compatible for reflow and rework of lead free assemblies: AT-707, AT-707FL, PRO 1600, PRO 1600-B.

February 2006 - Split Imaging Device for AT-707
This option allows components to be viewed diagonally. At high magnification, larger packages will extend outside the field of view on a monitor. This option breaks down the image of a component to show only its diagonal corners. Since BGA spheres / QFP leads are spaced symmetrically, by aligning opposite corners, the whole component will in turn be properly aligned. The option also increases component handling capability from a maximum size of 40mm X 40mm to 57mm X 57mm. Standard feature in the AT-707FL model. Part No: SID-AT707

August 2005 - New Location
As of August 1, 2005, the company has relocated to a new facility in suburban Philadelphia. Due to continued growth and expansion, additional space was necessary for manufacturing and R&D departments. The new facility represents our commitment in supplying and supporting quality equipment to our loyal customers.

February 2005 - New CAT90-M Manual Pick & Place System
Built on the platform of CAT90-SA semi-automatic system, CAT90-M delivers precise placement capability with the aid of a high resolution vision system. Components may be presented in feeders or in bulk on a carousel. Proven design and mechanics make the system an ideal choice for prototype assembly. For more information, contact the Sales Department.

July 2004 - Nozzle Kit for AT-707/FL
The new kit includes 10 of the most commonly selected nozzles ranging from 6mm X 6mm to 40mm X 40mm. Nozzles are priced at a 10% discount. Customers may substitute nozzles listed in the kit with other sizes at no additional charge. Part No: NZK-AT707

January 2003 - New PRO 1600 Forced Convection Reflow Oven
The redesigned PRO 1600 now offers superb heating uniformity with precise temperature control throughout the sealed heating chamber. ETC (External Thermocouple Control) option allows the profile to be executed based on the temperature reading of the application, not the air temperature around it. A built-in exhaust system automatically filters the air during the cooling period of the reflow profile. For more information, contact the Sales Department.

May 2002 - Breaking Down Rework - Article (PDF)
You will need Adobe Acrobat to view the article

July 2002 - 0201 Rework Package
An option to the AT-707 BGA/CSP Placement & Rework System, this package allows rework of components as tiny as 0201. Precise optics and nozzle technology provides accurate placement and uniform reflow. For more information, contact the Sales Department.

July 2002 - Flip-Chip Bonding
An option to the AT-707 BGA/CSP Placement & Rework System, FCB option converts the base system to a flip chip bonder within minutes. Placement force control, tray pick-up, and FP positioning system, are pre-installed features. Flux plates are used for even application. Heavy-Duty design prevents component shifts during alignment and heating. Perfect for prototype to low-volume development. FCB may be customized to various application requirements. For more information, contact the Sales Department.

April 2002 - Solder Removal System
An option to the AT-707 BGA/CSP Placement & Rework System, the SRS provides accurate and effective removal of excess solder from the "reworked" area on the PCB. The non-contact design ensures safe and damage-free operation. For more information, contact the Sales Department.

December 2001 - BGA Rework Services
Backed by years of experience in manufacturing BGA rework equipment, Advanced Techniques US, Inc. is now offering rework services. The Warminster, PA Rework Services Department is equipped with our own state-of-the-art AT-707 BGA systems using Split Beam and Split Imaging technologies. The facility is also equipped with various inspection systems to ensure that every board has been thoroughly inspected before being shipped. Our knowledge of the process, equipment, and profile optimization translates into fast, high-quality, and inexpensive service for the customer. For more information, contact the Rework Services Department.